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Alpha Introduces TrueHeight® Preforms to Prevent Die Tilt with Consistent Bondline Thickness

31 October 2017

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is introducing ALPHA® TrueHeight® Preforms, a solder preform engineered with embedded spacer technology that can address all major applications requiring 75µm bondline and above.

ALPHA® TrueHeight® Preforms are engineered with simplicity in mind to allow ease of implementation and maximum soldering performance.

The architecture of the design not only addresses the bondline thickness requirement, but also reduces the opportunity for voiding.

The design minimizes areas where gases can be trapped, compared to other technologies, during the reflow process.

“Engineers can be confident of achieving their design goals during manufacturing when using ALPHA® TrueHeight® Preforms”, said Eric Poh, Regional Product Manager for Solder Preforms at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses.

“TrueHeight® Preforms have the advantage of flexible spacer positioning, so strategic locations can be chosen to ensure consistent bondline thickness”.


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